Thermal Copper Pillar Bump: Cooling the micro and graphics processors hotspot areas
About this audiobook
What Is Thermal Copper Pillar Bump
The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips), laser diodes, and semiconductor optical amplifiers. The thermal bump is also known as the thermal copper pillar bump (SOA). Thermal bumps, as opposed to traditional solder bumps, which provide an electrical path and a mechanical connection to the package, act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Conventional solder bumps also provide a mechanical connection to the package. A thermal bump has a diameter of 238 micrometers and a height of 60 micrometers.
How You Will Benefit
(I) Insights, and validations about the following topics:
Chapter 1: Thermal copper pillar bump
Chapter 2: Solder
Chapter 3: Printed circuit board
Chapter 4: Ball grid array
Chapter 5: Thermoelectric cooling
Chapter 6: Flip chip
Chapter 7: Thermoelectric materials
Chapter 8: Desoldering
Chapter 9: Thermal management (electronics)
Chapter 10: Power electronic substrate
Chapter 11: Flat no-leads package
Chapter 12: Thermoelectric generator
Chapter 13: Thermal management of high-power LEDs
Chapter 14: Microvia
Chapter 15: Thick-film technology
Chapter 16: Soldering
Chapter 17: Failure of electronic components
Chapter 18: Glass frit bonding
Chapter 19: Decapping
Chapter 20: Thermal inductance
Chapter 21: Glossary of microelectronics manufacturing terms
(II) Answering the public top questions about thermal copper pillar bump.
(III) Real world examples for the usage of thermal copper pillar bump in many fields.
(IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of thermal copper pillar bump' technologies.
Who This Book Is For
Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of thermal copper pillar bump.
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About the author
Fouad Sabry is the former Regional Head of Business Development for Applications at HP in Southern Europe, Middle East, and Africa (SEMEA). Fouad has received his B.Sc. of Computer Systems and Automatic Control in 1996, dual masterâs degrees from University of Melbourne (UoM) in Australia, Master of Business Administration (MBA) in 2008, and Master of Management in Information Technology (MMIT) in 2010.
Fouad has more than 20 years of experience in Information Technology and Telecommunications fields, working in local, regional, and international companies, such as Vodafone and IBM in Middle East and Africa (MEA) region. Fouad joined HP Middle East (ME), based in Dubai, United Arab Emirates (UAE) in 2013 and helped develop the software business in tens of markets across Southern Europe, Middle East, and Africa (SEMEA) regions. Currently, Fouad is an entrepreneur, author, futurist, focused on Emerging Technologies, and Industry Solutions, and founder of One Billion Knowledgeable (1BK) Initiative.
