Components, Packaging and Manufacturing Technology
Yanwen Wu
ጃን 2011 · Trans Tech Publications Ltd
ኢ-መጽሐፍ
870
ገጾች
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reportየተሰጡት ደረጃዎች እና ግምገማዎች የተረጋገጡ አይደሉም የበለጠ ለመረዳት
ስለዚህ ኢ-መጽሐፍ
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
ለዚህ ኢ-መጽሐፍ ደረጃ ይስጡ
ምን እንደሚያስቡ ይንገሩን።
የንባብ መረጃ
ዘመናዊ ስልኮች እና ጡባዊዎች
የGoogle Play መጽሐፍት መተግበሪያውን ለAndroid እና iPad/iPhone ያውርዱ። ከእርስዎ መለያ ጋር በራስሰር ይመሳሰላል እና ባሉበት የትም ቦታ በመስመር ላይ እና ከመስመር ውጭ እንዲያነቡ ያስችልዎታል።
ላፕቶፖች እና ኮምፒውተሮች
የኮምፒውተርዎን ድር አሳሽ ተጠቅመው በGoogle Play ላይ የተገዙ ኦዲዮ መጽሐፍትን ማዳመጥ ይችላሉ።
ኢሪደሮች እና ሌሎች መሳሪያዎች
እንደ Kobo ኢ-አንባቢዎች ባሉ ኢ-ቀለም መሣሪያዎች ላይ ለማንበብ ፋይል አውርደው ወደ መሣሪያዎ ማስተላለፍ ይኖርብዎታል። ፋይሎቹን ወደሚደገፉ ኢ-አንባቢዎች ለማስተላለፍ ዝርዝር የእገዛ ማዕከል መመሪያዎቹን ይከተሉ።
