Flexible Electronics: Materials and Applications
À propos de cet e-book
Topics covered include:
- An overview and history of flexible electronics
- Novel materials for solution-processable thin-film electronic devices and their properties
- Low-temperature processing of conventional materials and devices on plastic foils
- Novel techniques, such as printing and roll-to-roll processing, for large-area flexible electronics manufacturing
- Materials and device physics relevant to flexible electronics
- Device integration on flexible substrates
- Mechanical and electronic characteristics for thin-film transistors and nano-scale transparent conductors on flexible platforms
- Applications towards flexible displays, sensors, actuators, solar energy, radio-frequency identification, and micro-electro-mechanical systems
Written by leading researchers in the field, Flexible Electronics: Materials and Applications serves as a reference for researchers, engineers, and students interested in the characteristics, capabilities, and limitations of these exciting materials and emerging applications.
Notes et avis
À propos de l'auteur
William Wong received his B.S. from the University of California, Los Angeles, in 1990, his M.S. from the University of California, San Diego, in 1995 and his Ph.D. from the University of California, Berkeley, in 1999. He was an associated research engineer for Siemens Solar Industries in Camarillo, CA, form 1990-1992. Since 2000, he has been a senior member of the research staff at the Palo Alto Research Center.
Alberto Salleo received his physics degree in 1994 from Ecole Polytechnique in France; his M.S. from the University of California, Berkeley in 1998; and his Ph.D. from the University of California, Berkeley, in 2001. He has held several positions such as visiting scholar and graduate student researcher and currently is a researcher in the Electronic Materials Laboratory at the Palo Alto Research Center. In January, 2006, he will become an Assistant Professor for the Department of Materials Science and Engineering at Stanford University.
