Interfaces Crystallization Viscoelasticity
2003年7月 · Advances in Polymer Science 第 148 冊 · Springer
電子書
205
頁數
report評分和評論未經驗證 瞭解詳情
關於這本電子書
Epoxy resins are regarded as thermosetting resins and have found various c- mercial applications after crosslinking with adequate curing agents [1–3]. H- ever, some epoxy resins have been used as thermoplastic resins without curing agents. Figure 1 shows the applications of epoxy resins that are classi?ed to three categories: thermosets in combination with curing agents, thermoplastics wi- out curing agents, and raw materials for modi?cation. The use in thermoplastics is not popular compared with the two other applications. Typical thermoplastic applications are found in stabilizers for vinyl resins, toners for copying - chines, ?re retardants for engineering plastics, and sizing material for glass or carbon ?bers. The epoxy resin most frequently used is the oligomer of the diglycidyl ether of bisphenol-A (DGEBA) whose chemical structure is shown below [1–3]. The DGEBA is composed of linear molecules with different molecular weights according to the variation of the repeated number (n) in the structural formula.
為這本電子書評分
請分享你的寶貴意見。
閱讀資訊
智能手機和平板電腦
手提電腦和電腦
你可以使用電腦的網絡瀏覽器聆聽在 Google Play 上購買的有聲書。
電子書閱讀器及其他裝置
如要在 Kobo 等電子墨水裝置上閱覽書籍，你需要下載檔案並傳輸到你的裝置。請按照說明中心的詳細指示，將檔案傳輸到支援的電子書閱讀器。
